PuSH - Publikationsserver des Helmholtz Zentrums München

Model-based optoacoustic image reconstruction of large three-dimensional tomographic datasets acquired with an array of directional detectors.

IEEE Trans. Med. Imaging 33, 433-443 (2013)
DOI PMC
Open Access Green möglich sobald Postprint bei der ZB eingereicht worden ist.
Image quality in 3-D optoacoustic (photoacoustic) tomography is greatly influenced by both the measurement system, in particular the number and spatial arrangement of ultrasound sensors, and the ability to account for the spatio-temporal response of the sensor element(s) in the reconstruction algorithm. Herein we present a reconstruction procedure based on the inversion of a time-domain forward model incorporating the spatial impulse response due to the shape of the transducer, which is subsequently applied in a tomographic system based on a translation-rotation scan of a linear detector array. The proposed method was also adapted to cope with the data-intensive requirements of high-resolution volumetric optoacoustic imaging. The processing of 2.10(4) individual signals resulted in well-resolved images of both similar to 200 mu m absorbers in phantoms and complex vascular structures in biological tissue. The results reported herein demonstrate that the introduced model-based methodology exhibits a better contrast and resolution than standard back-projection and model-based algorithms that assume point detectors. Moreover, the capability of handling large datasets anticipates that model-based methods incorporating the sensor properties can become standard practice in volumetric optoacoustic image formation.
Altmetric
Weitere Metriken?
Zusatzinfos bearbeiten [➜Einloggen]
Publikationstyp Artikel: Journalartikel
Dokumenttyp Wissenschaftlicher Artikel
Korrespondenzautor
Schlagwörter Computed Tomography ; Inverse Problems ; Optoacoustic ; Spatial Impulse Response; Photoacoustic Tomography; Algorithm
ISSN (print) / ISBN 0278-0062
e-ISSN 1558-254X
Quellenangaben Band: 33, Heft: 2, Seiten: 433-443 Artikelnummer: , Supplement: ,
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Verlagsort New York, NY [u.a.]
Nichtpatentliteratur Publikationen
Begutachtungsstatus Peer reviewed