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Abrouk, M.* ; Balcárková, B.* ; Šimková, H.* ; Komínkova, E.* ; Martis, M.M. ; Jakobson, I.* ; Timofejeva, L.* ; Rey, E.* ; Vrana, J.* ; Kilian, A.* ; Järve, K.* ; Dolezel, J.* ; Valárik, M.*

The in silico identification and characterization of a bread wheat/Triticum militinae introgression line.

Plant Biotechnol. J. 15, 249-256 (2017)
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Open Access Gold
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The capacity of the bread wheat (Triticum aestivum) genome to tolerate introgression from related genomes can be exploited for wheat improvement. A resistance to powdery mildew expressed by a derivative of the cross-bread wheat cv. Tähti × T. militinae (Tm) is known to be due to the incorporation of a Tm segment into the long arm of chromosome 4A. Here, a newly developed in silico method termed rearrangement identification and characterization (RICh) has been applied to characterize the introgression. A virtual gene order, assembled using the GenomeZipper approach, was obtained for the native copy of chromosome 4A; it incorporated 570 4A DArTseq markers to produce a zipper comprising 2132 loci. A comparison between the native and introgressed forms of the 4AL chromosome arm showed that the introgressed region is located at the distal part of the arm. The Tm segment, derived from chromosome 7G, harbours 131 homoeologs of the 357 genes present on the corresponding region of Chinese Spring 4AL. The estimated number of Tm genes transferred along with the disease resistance gene was 169. Characterizing the introgression's position, gene content and internal gene order should not only facilitate gene isolation, but may also be informative with respect to chromatin structure and behaviour studies.
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Publication type Article: Journal article
Document type Scientific Article
Corresponding Author
Keywords Alien Introgression ; Chromosome Rearrangement ; Chromosome Translocation ; Comparative Analysis ; Genomezipper ; Linkage Drag; Crop Improvement; Powdery Mildew; Common Wheat; Chromosomes; Genome; Resistance; Plant; Recombination; Evolution; Barley
ISSN (print) / ISBN 1467-7644
e-ISSN 1467-7652
Quellenangaben Volume: 15, Issue: 2, Pages: 249-256 Article Number: , Supplement: ,
Publisher Wiley
Publishing Place Hoboken
Non-patent literature Publications
Reviewing status Peer reviewed